The application and research status of tin whisker formation in electric usage

Abstract

`Hair Like’ crystalline structure grows from most pure tin or zinc finishes. Usually, the diameter of tin whisker is up to 10 mm and the length of tin whisker is typically 1 µm. In detail, the questions for tin whisker formation are classified into 6 categories: 1. Residual stress with in the tin plating; 2. Intermetallic Formation; 3. Externally Applied Compressive Stress; 4. Bending and Stretching; 5. Scratches and Nicks; 6. Coefficient of Thermal Expansion Mismatches. The result shows that, whisker formation could causes electrical short circuit (High current of whisker melting), debris contamination (Sensitive Optical and Micro Electrical Mechanical System) and metal vapor (Vaporize Damage). Thus, it is suggested that environmental tests and standards (Whisker Shape, Temperature, Pressure, Moisture, Thermal Cycling, and Electrical Field) are required for suppressing whisker formation. Nowadays, the new standards committee of Europe Union acts RoHS (Restriction of certain Hazardous Substances) and WEEE (Waste Electrical and Electronic Equipment) to restrict Pb usage. Thus, new compounds adding to alloys to suppress whiskers are required in electronic application area. In summary, the tin whisker formation is largely influenced by compositions and precipitations.